Job description

Title:
Mechanical/Advanced Packaging Engineer

KBR is seeking to fill an entry level Mechanical/ Integrated Circuit (IC) Packaging Engineer position with a Bachelors or Masters in Mechanical Engineering, Electrical Engineering, Physics/Chemistry, or Materials Science with a high mechanical aptitude with ability to quickly learn multiple complex systems and software platforms in support of semiconductor device research at the Air Force Research Laboratory.

This position is located at the Air Force Research Laboratory, Sensor Directorate, Wright Patterson AFB, OH.

The selected candidate will provide the following packaging engineering support in an ad-hoc type laboratory environment under moderate supervision.

While working with electrical design engineers, applicant will be expected to design new, novel and appropriate microelectronics packaging solutions, manufacturing processes, layouts for assemblies and define equipment requirements as needed. Contributes to advanced manufacturing projects in the development of new microelectronics packaging processes, materials and equipment. This will include design of experiments with materials sets and tool solutions for integrated circuit (IC) die-bonding, flip-chip, SMT, wirebonding, bare die chip attach and device integration.

Will be responsible for the use and maintenance of over a dozen complex pieces of equipment in a microelectronics rapid prototyping laboratory. This includes multi-axis cnc, additive manufacturing (Stratasys Objet and Fortus), multi-layer printed circuit board fabrication equipment (photolithography, lpkf prototyping systems), integrated circuit (IC) level packaging (wirebonding(manual and automated), flip chip (finetech)), SMT assembly, and through hole plating (electroless and electroplated copper).

Qualifications

Bachelors or Masters in Mechanical Engineering, Electrical Engineering, Physics/Chemistry, or Materials Science. Other relevant degrees are also considered

Self-motivated, self-starter, attention to detail, and passionate about your work. Effective oral/written communication skills with knowledge on how to prepare and present technical information to peers. Effective interpersonal and team skills.

High degree of personal accountability, with the ability to work independently and deliver results within project specific timelines.

High mechanical aptitude with ability to quickly learn multiple complex systems and software platforms

Demonstrate ability to define and optimize critical process parameters

Proficiency with 3D CAD tools such as Solidworks, CAM software

Proficiency with ANSYS, FEA, thermal and structural analysis software

Knowledge of manufacturing processes in the fabrication of printed circuit boards and microelectronics assembly a plus

Proficiency with PCB layout software such as Mentor Graphics PADS or Cadence Allegro a plus

Must be a US citizen to obtain Department of Defense security Clearance.

KBR is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, disability, sex, sexual orientation, gender identity or expression, age, national origin, veteran status, genetic information, union status and/or beliefs, or any other characteristic protected by federal, state, or local law.

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